Semiconductor materials are partial conductors of electricity. Their conductivity lies between the insulators and conductors. Silicon is the most commonly used semiconducting material, and semiconductors serve as a foundational technology for many devices.
The demand for advanced level packaging that helps reduce node size and supports large volume production has compelled the development of various packaging technologies. Apart from the node size transition, the emergence of 3D ICs is also increasing the investments in packaging technologies. With the growing complexity in manufacturing, along with the reduction in node size, it has become critical for semiconductor manufacturers to consistently maintain the production yield and improve the scale of production with every node size transition.
Additionally, there are packaging technologies that support 3D packaging of 2D ICs and packaging of 3D ICs. These technologies are rapidly gaining traction among IDMs and OSATs and are expected to replace legacy IC packaging technologies such as lead frame wire bonding, ball grid array wire bonding, and wire bond chip-scale packaging. The advantages of emerging packaging technologies include finer pitch pad, nanoscale patterning, high-density stacking, SIP, FinFET fabrication, SOI fabrication, and SIP fabrication. Thus, the emerging semiconductor packaging technologies will augment the growth of the global semiconductor market size at a CAGR of 8.77% during the forecast period.
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